The split UV laser marking machine features a split-type design, separating the laser source from the marking head, which significantly enhances equipment deployment flexibility. It adapts well to production lines, mobile workstations, and confined spaces. Combining 355nm UV cold processing technology, it achieves an ultra-fine spot diameter of ≤0.017mm and a heat-affected zone of <1μm, enabling perfectly precise and non-damaging marking on materials like plastics, glass, and metal coatings. It supports dynamic serial numbers, invisible QR codes, and complex graphics, integrating smart software like EzCAD to meet diverse industry demands. This machine is an efficiency innovation tool for fields such as electronic components, medical packaging, and luxury goods anti-counterfeiting.
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Applications
UV laser marking machines leverage cold processing, high precision, and multi-material adaptability as core competencies, excelling particularly in handling heat-sensitive, highly reflective, or materials requiring ultra-fine processing. They can achieve sub-micron level non-thermal damage engraving on surfaces including metal coatings, polymers: (e.g., ABS, PVC, HDPE, and other plastics), glass, ceramics and more.
Plastic part laser marking
Leather laser engraving
PCB laser marking
PU hose laser marking
Silicone laser marking
Glass bottle laser marking
PET white bottle laser marking
PC card laser marking
PP laser marking
Silicone cup sleeve laser marking
Plastic bottle cap laser marking
Glass wine bottle laser marking
Crystal laser marking
Glass cup laser marking
Technical Data
Configuration
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Technical Data
Laser power 3W, 5W, 10W
Laser type UV laser
Laser wavelength 355nm
Marking range ≤300×300mm
Beam quality M²<1.2~1.5
Max. line speed 7000mm/s
Min. character size 0.05mm
Min. line width 0.01mm
Cooling method water cooling
Power supply 220V/50Hz, 110V/60Hz
Operating temperature 10℃~35℃ (Operating outside this range may affect equipment performance and lifespan)
Laser source
We provide renowned domestic and international brand laser sources for our equipment, such as DXT, GL, and Optowave. These sources offer high pump conversion efficiency, low power consumption, and excellent beam quality. Utilizing third-order intracavity frequency doubling technology, the wavelength is shorter than that of fiber (1064nm) and CO₂ (10.64μm) lasers, resulting in higher photon energy. This allows for direct breaking of material molecular chains rather than heating, achieving a "photo-etching" effect with a minimal heat-affected zone (<1μm), thereby preventing material deformation or scorching.
Galvo scanner
Features a high scanning speed of 7000mm/s, high stability, and is equipped with a dual-red-light focusing device, which significantly enhances focusing efficiency.
F-theta lens
Equipped with a 355nm wavelength F-theta lens, primarily used for uv laser marking machines. Due to its shorter wavelength, it is suitable for marking various metal and non-metal materials. It supports long-term operation without the need for consumables to be added or replaced. Currently, we have received no user feedback regarding F-theta lens damage.
Control card
Equipped with a genuine JCZ EZCAD control board, ensuring the stability of the entire marking system. The software interface supports multiple language versions (Chinese, English, Italian, Russian, Korean, Japanese, Spanish, Portuguese, etc.). Its powerful functions include text marking, QR code marking, vector graphic marking, automatic serial number skipping, and more.
Laptop
Utilizes a major brand Lenovo laptop, equipped with Windows 10 system and a 14-inch display, ensuring smoother operation of the entire laser equipment.
Column
Features electric lifting and lowering, adapting to marking workpieces of various heights without manual adjustment, significantly improving overall work efficiency.
Laser safety warning labels
Plays a crucial role in scenarios involving laser applications, primarily serving to alert people to potential laser hazards and ensure personnel safety.
What types of marking can the UV marking system achieve on PCB boards?
It can achieve various types of marking including QR codes/barcodes, serial numbers, LOGOs, component identification, production dates, and more.
Will the UV marking machine damage circuits or substrates during PCB marking?
UV laser is a cold processing method, where energy is concentrated on the material surface with almost no heat-affected zone. It will not damage circuits or substrates.
Does UV Laser Engraving on glass cause glass breakage or chipping?
UV lasers can achieve sub-micron level etching on glass surfaces. By adjusting parameters, it typically does not cause breakage or chipping.
Standard Configuration
Optional Configuration
Accessory List
Fume Extractor
F-theta lens
Cylindrical rotary clamp fixture
Roller rotary axis